JPH0575027B2 - - Google Patents
Info
- Publication number
- JPH0575027B2 JPH0575027B2 JP23422186A JP23422186A JPH0575027B2 JP H0575027 B2 JPH0575027 B2 JP H0575027B2 JP 23422186 A JP23422186 A JP 23422186A JP 23422186 A JP23422186 A JP 23422186A JP H0575027 B2 JPH0575027 B2 JP H0575027B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- resin
- copper foil
- coating film
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23422186A JPS6389577A (ja) | 1986-09-30 | 1986-09-30 | 導電塗料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23422186A JPS6389577A (ja) | 1986-09-30 | 1986-09-30 | 導電塗料 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6389577A JPS6389577A (ja) | 1988-04-20 |
JPH0575027B2 true JPH0575027B2 (en]) | 1993-10-19 |
Family
ID=16967596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23422186A Granted JPS6389577A (ja) | 1986-09-30 | 1986-09-30 | 導電塗料 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6389577A (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3373610B2 (ja) * | 1993-08-23 | 2003-02-04 | オリヱント化学工業株式会社 | 帯電性樹脂粉体及びその関連技術 |
US6322620B1 (en) | 2000-11-16 | 2001-11-27 | National Starch And Chemical Investment Holding Corporation | Conductive ink composition |
JP6506897B1 (ja) | 2018-10-15 | 2019-04-24 | 株式会社Uacj | 磁気ディスク用アルミニウム合金板及びその製造方法、ならびに、当該磁気ディスク用アルミニウム合金板を用いた磁気ディスク |
-
1986
- 1986-09-30 JP JP23422186A patent/JPS6389577A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6389577A (ja) | 1988-04-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2016527665A (ja) | ポリマー厚膜銅導体組成物の光焼結 | |
JPS612202A (ja) | 鑞付容易な電気伝導性組成物、その製法、該組成物が適用される基材の処理法および該組成物が適用されたプリント回路板 | |
JPS6355807A (ja) | 導電性ペ−スト | |
JP2008130301A (ja) | 導電性銅ペースト | |
KR101398706B1 (ko) | 도전성 페이스트 | |
JP2965815B2 (ja) | 半田付け可能な塗膜形成用導電性ペースト | |
CN1082705C (zh) | 导电浆料 | |
JP2013199648A (ja) | ポリマー厚膜はんだ合金/金属導電体組成物 | |
JPH0575027B2 (en]) | ||
JPH0585588B2 (en]) | ||
WO2012066957A1 (ja) | 導電性組成物、導電膜、及び導電膜の形成方法 | |
JPH0240269B2 (en]) | ||
JP2002332502A (ja) | 銅ペースト用の表面処理銅粉、その表面処理銅粉の製造方法、その表面処理銅粉を用いた銅ペースト及びその銅ペーストを用いたプリント配線板 | |
JPS62230869A (ja) | 半田付可能な導電塗料 | |
TW201120162A (en) | Polymer thick film silver electrode composition for use as a plating link | |
JPH01167385A (ja) | 導電塗料 | |
JPH0149390B2 (en]) | ||
JP2628734B2 (ja) | 導電ペースト | |
JPH0619075B2 (ja) | 半田付可能な導電塗料 | |
JPH0436903A (ja) | 銅系導電性ペースト | |
JP3316746B2 (ja) | 導電塗料 | |
JPH0415270A (ja) | 導電ペースト | |
JPH0552862B2 (en]) | ||
JPH04756B2 (en]) | ||
JPS6324630B2 (en]) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |